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 Model Number |
NSX-180 |
Application/ Features
- The NSX-180 is the perfect solution for low slice. part off and wafer slicing, optimized for critical thin film slicing and grinding operation.
- Ceramic, glass and advanced material application can also be performed with exacting precision
Specification
Capacity
|
Part size capability |
125mm(5.00") |
Table
feed travel (X)
|
350mm(13.75") |
| Index travel (Y) |
125mm(5.00") |
| Vertical travel
(Z) |
50mm(2.00") |
| Feed rate (X) |
2.5 to 5,000mm/min
(0.1 to 195"/min) |
| Feed rate (Y &
Z) |
2.5 to 2,000mm/min
(0.1 to 78"/min) |
| Spindle speed |
up to 3,000 to
30,000rpm |
| Spindle power |
2.0kW(2.8HP)(Other
Spindle Options/Available) |
Resolution |
X(Feed)
Y(Index)
Z(Vertical)
O(Rotary)
|
0.100µm(4.0µ-in)
0.100µm(4.0µ-in)
0.100µm(4.0µ-in)
0.100(0.36arc-sec) |
Indexing accuracy |
Y Axis |
±0.50µm(±20.0µ-in) |
Control unit |
GE Fanuc series |
210MB with MTI
PC Interface |
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